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Brand Name : IBE
Model Number : Flex Rigid PCB
Certification : ISO/TS16949 ISO13485
Place of Origin : China
MOQ : 10
Price : $0.1-$0.5
Payment Terms : D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 50000pcs/week
Delivery Time : 5-8 working days
Packaging Details : ESD bag
Min. line width : 0.075mm/0.075mm(3mil/3mil)
Surface finishing : ENIG
Copper thickness : 1oz
Base material : FR4
Min. line spacing : 0.075mm
Board thickness : 1.6mm
Min. hole size : 0.25mm
soldermask color : green
silkscreen color : white
layer : 1-32L
Customized Fr4 Polyimide LED Rigid-Flex PCBA PCB Manufacturing
About IBE Corporation
Founded in 2005, IBE Corporation is a mid-size provider of end-to-end electronics manufacturing services (EMS) including PCBA production, systems integration and comprehensive testing services, enclosure fabrication, as well as product design, sustaining engineering and supply chain management services. IBE facilities span a broad footprint in the China,United States and Vietnam. IBE services extend over the entire electronic product life cycle from the development and introduction of new products through to the growth, maturity and end-of-life phases.
Certification:
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.
PCB Manufacturing Capability | |
PCB Layers: | 1Layers to 18 layer (Max) |
Board thickness: | 0.13~6.0mm |
Min line width/space: | 3mil |
Min mechanical hole size: | 4mil |
Copper thickness: | 9um~210um(0.25oz~6oz) |
Max aspect ratio: | 1:10 |
Max board size: | 400*700mm |
Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
PCB Assembly Capability | |
Stencil size range: | 1560*450mm |
Min SMT package: | 0402/1005(1.0x0.5mm) |
Min IC pitch: | 0.3mm |
Max PCB Size: | 1200*400mm |
Min PCB thickness: | 0.35mm |
Min Chip Size: | 01005 |
Max BGA Size: | 74*74mm |
BGA Ball Pitch: | 1.00~3.00mm |
BGA Ball Diameter: | 0.4~1.0mm |
QFP Lead Pitch: | 0.38~2.54mm |
Testing : | ICT,AOI,X-RAY,Funtional test etc. |
For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file
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ENIG LED Smt Electronics Flex Pcb Manufacturing ISO TS16949 Images |